{"id":26944,"date":"2022-06-08T16:20:38","date_gmt":"2022-06-08T08:20:38","guid":{"rendered":"https:\/\/www.accscicn.com\/?p=26944"},"modified":"2022-10-26T15:58:31","modified_gmt":"2022-10-26T07:58:31","slug":"mems_fabrication_06","status":"publish","type":"post","link":"https:\/\/www.accscicn.com\/es\/soluciones\/nanofabricacion\/mems_fabricacion_06\/","title":{"rendered":"Procesado micro y nano | Procesado fino MEMS (VI)"},"content":{"rendered":"<div data-elementor-type=\"wp-post\" data-elementor-id=\"26944\" class=\"elementor elementor-26944\" data-elementor-post-type=\"post\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-54128778 elementor-section-full_width elementor-section-stretched elementor-section-height-default elementor-section-height-default\" data-id=\"54128778\" data-element_type=\"section\" data-settings=\"{&quot;stretch_section&quot;:&quot;section-stretched&quot;,&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-69c843a5\" data-id=\"69c843a5\" data-element_type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-inner-section elementor-element elementor-element-6a18ec9 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"6a18ec9\" data-element_type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-inner-column elementor-element elementor-element-1744f10\" data-id=\"1744f10\" data-element_type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-6fc1209b elementor-widget elementor-widget-heading\" data-id=\"6fc1209b\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t<style>\/*! elementor - v3.21.0 - 20-05-2024 *\/\n.elementor-heading-title{padding:0;margin:0;line-height:1}.elementor-widget-heading .elementor-heading-title[class*=elementor-size-]>a{color:inherit;font-size:inherit;line-height:inherit}.elementor-widget-heading .elementor-heading-title.elementor-size-small{font-size:15px}.elementor-widget-heading .elementor-heading-title.elementor-size-medium{font-size:19px}.elementor-widget-heading .elementor-heading-title.elementor-size-large{font-size:29px}.elementor-widget-heading .elementor-heading-title.elementor-size-xl{font-size:39px}.elementor-widget-heading .elementor-heading-title.elementor-size-xxl{font-size:59px}<\/style><h1 class=\"elementor-heading-title elementor-size-default\"><b>Micro y nanoprocesamiento | Procesado fino MEMS<\/b><\/h1>\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-24ca13ca elementor-widget elementor-widget-text-editor\" data-id=\"24ca13ca\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t<style>\/*! elementor - v3.21.0 - 20-05-2024 *\/\n.elementor-widget-text-editor.elementor-drop-cap-view-stacked .elementor-drop-cap{background-color:#69727d;color:#fff}.elementor-widget-text-editor.elementor-drop-cap-view-framed .elementor-drop-cap{color:#69727d;border:3px solid;background-color:transparent}.elementor-widget-text-editor:not(.elementor-drop-cap-view-default) .elementor-drop-cap{margin-top:8px}.elementor-widget-text-editor:not(.elementor-drop-cap-view-default) .elementor-drop-cap-letter{width:1em;height:1em}.elementor-widget-text-editor .elementor-drop-cap{float:left;text-align:center;line-height:1;font-size:50px}.elementor-widget-text-editor .elementor-drop-cap-letter{display:inline-block}<\/style>\t\t\t\t<p style=\"font-size: 16px; font-style: normal;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\"><b>1.6 Tecnolog\u00eda de la capa de sacrificio<\/b><\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">La tecnolog\u00eda de capa de sacrificio tambi\u00e9n se conoce como tecnolog\u00eda de capa de separaci\u00f3n. En la tecnolog\u00eda de capa de sacrificio, se forma un microcomponente sobre un sustrato de silicio mediante deposici\u00f3n qu\u00edmica de vapor, se a\u00f1ade una capa separadora al vac\u00edo que rodea al componente y, por \u00faltimo, se elimina la capa separadora mediante disoluci\u00f3n o grabado para separar el microcomponente del sustrato.<\/span><\/p><p style=\"font-size: 16px; font-style: normal;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\"><b>1.7 Epitaxia<\/b><\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">El crecimiento epitaxial es una de las herramientas m\u00e1s importantes del micromecanizado. Se caracteriza por el hecho de que la capa epitaxial puede mantener la misma orientaci\u00f3n cristalina que el sustrato, lo que permite llevar a cabo diversas distribuciones transversales y longitudinales de dopaje y procesos de grabado en la capa epitaxial para producir diversas estructuras.<\/span><\/p><p style=\"font-size: 16px; font-style: normal;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\"><b>1.8 Tecnolog\u00eda LIGA y cuasi-LIGA<\/b><\/span><\/p><p style=\"font-size: 16px; font-style: normal;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">(1) Tecnolog\u00eda LIGA<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">La t\u00e9cnica LIGA fue desarrollada por primera vez por el Centro Alem\u00e1n de Investigaci\u00f3n de F\u00edsica Nuclear de Karlsruhe y est\u00e1 reconocida como una nueva t\u00e9cnica de microfabricaci\u00f3n tridimensional. El paso m\u00e1s importante es la producci\u00f3n de m\u00e1scaras de alta precisi\u00f3n, y el m\u00e1s importante, la litograf\u00eda mediante una fuente de radiaci\u00f3n sincrotr\u00f3n, generada por un acelerador magn\u00e9tico de electrones con una longitud de onda de 0,2 a 0,6 nm y que produce rayos con alta densidad de energ\u00eda y paralelismo.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">Debido a la capacidad de penetraci\u00f3n profunda de los rayos X, la litograf\u00eda de rayos X puede producir microm\u00e1quinas de hasta 1 mm de altura con dimensiones perif\u00e9ricas en el rango de micras o submicras, un rango de tama\u00f1o que s\u00f3lo puede conseguirse con la alta energ\u00eda de las fuentes de radiaci\u00f3n sincrotr\u00f3n.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">Para crear estructuras con voladizos, se ha desarrollado la tecnolog\u00eda LIGA de capa de sacrificio. La tecnolog\u00eda LIGA de capa de sacrificio es un importante m\u00e9todo micromec\u00e1nico para la fabricaci\u00f3n de micromotores y microsensores, para la fabricaci\u00f3n de microestructuras con voladizos y para la conexi\u00f3n de circuitos microelectr\u00f3nicos.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">Las limitaciones de la t\u00e9cnica LIGA son la necesidad de utilizar fuentes de rayos X de sincrotr\u00f3n, el largo tiempo de procesamiento, la complejidad del proceso, el elevado coste y la dificultad de crear microestructuras con superficies curvas.<\/span><\/p><p style=\"font-size: 16px; font-style: normal;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">(2) Tecnolog\u00eda Quasi-LIGA<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">La tecnolog\u00eda LIGA tiene algunas ventajas \u00fanicas en cuanto a la amplia gama de materiales procesados y la gran precisi\u00f3n, pero tambi\u00e9n presenta algunos de los inconvenientes antes mencionados. Para superar los inconvenientes de LIG-<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">Un proceso de deficiencias tecnol\u00f3gicas, investigaci\u00f3n internacional sobre tecnolog\u00eda cuasi LIGA, como la tecnolog\u00eda cuasi LIGA de silicio, litograf\u00eda profunda UV, estereolitograf\u00eda UV, tecnolog\u00eda LIGA l\u00e1ser, etc.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">\u2460 Tecnolog\u00eda cuasi-LIGA de silicio. Proceso de grabado profundo en lugar de litograf\u00eda profunda de rayos X de sincrotr\u00f3n, seguido de posterior microelectroformado y<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">El proceso de microcopia, que no requiere costosas fuentes de luz de sincrotr\u00f3n ni placas de m\u00e1scara LIGA especiales. Mediante el uso de equipos de grabado por plasma de acoplamiento inductivo (ICD: induc-tively coupled plasma) para el grabado de pl\u00e1stico o silicio de alta relaci\u00f3n de aspecto, la fundici\u00f3n microel\u00e9ctrica directamente a partir de obleas de silicio, moldes met\u00e1licos y, a continuaci\u00f3n, procesos de microcopia, se puede lograr una producci\u00f3n de gran volumen de dispositivos micromec\u00e1nicos. Esta tecnolog\u00eda permite la fabricaci\u00f3n de microestructuras con elevadas relaciones de aspecto en materiales distintos del silicio y una mayor compatibilidad con la tecnolog\u00eda microelectr\u00f3nica. Este sistema se caracteriza por el uso de SF6 como principal gas de grabado y no requiere procesos de postratamiento. Esta tecnolog\u00eda de grabado de alta relaci\u00f3n de aspecto supone un gran paso adelante en la aplicaci\u00f3n de la micromec\u00e1nica del silicio y permite fabricar estructuras de molde de alta relaci\u00f3n de aspecto que antes s\u00f3lo eran posibles con la tecnolog\u00eda LIGA.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">\u2461 Tecnolog\u00eda LIGA l\u00e1ser. Se utilizan l\u00e1seres exc\u00edmeros a 193 nm para ablacionar directamente fotorresistencias de PMMA en lugar de la litograf\u00eda de rayos X. Como el l\u00e1ser exc\u00edmer requiere la sustituci\u00f3n peri\u00f3dica del gas de trabajo, el consumo de gas es elevado y requiere un mantenimiento frecuente, lo que tambi\u00e9n puede afectar al proceso de producci\u00f3n. El l\u00e1ser de estado s\u00f3lido YAG puede utilizarse para producir un l\u00e1ser ultravioleta lejano de frecuencia cu\u00e1druple mediante cristales KTP y BBO para evitar las deficiencias mencionadas de los l\u00e1seres de exc\u00edmeros, que son capaces de funcionar a largo plazo y tienen una calidad litogr\u00e1fica m\u00e1s estable y fiable.<\/span><\/p><p style=\"font-size: 16px; font-style: normal;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\"><b>1.9 T\u00e9cnicas especiales de microfabricaci\u00f3n<\/b><\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">(1) Micro EDM<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">El principio de la microelectroerosi\u00f3n no difiere fundamentalmente del de la electroerosi\u00f3n ordinaria. La clave de la microelectroerosi\u00f3n es la fabricaci\u00f3n del microeje (electrodo de herramienta), la fuente de alimentaci\u00f3n de descarga de microenerg\u00eda, la microalimentaci\u00f3n servo del electrodo de herramienta, la detecci\u00f3n del estado de mecanizado, el control del sistema y el proceso de mecanizado. Dado que los microelectrodos son extremadamente dif\u00edciles o imposibles de producir, no resulta pr\u00e1ctico utilizar el m\u00e9todo tradicional de electroerosi\u00f3n para el microcontorneado 3D, por lo que se ha empezado a explorar el uso de electrodos de formas sencillas para la electroerosi\u00f3n de microcontorneado 3D mediante fresado CNC. Con la aplicaci\u00f3n de la tecnolog\u00eda de microelectroerosi\u00f3n, ahora se pueden mecanizar microejes con un di\u00e1metro de 2,5 \u03bcm y microagujeros con un di\u00e1metro de 5 \u03bcm, y se pueden fabricar micromoldes para autom\u00f3viles con una longitud de 0,5 mm, una anchura de 0,2 mm y una profundidad de 0,2 mm. Pueden fabricarse microengranajes con un di\u00e1metro de 0,3 mm y un m\u00f3dulo de 0,1 mm.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">(2) Tratamiento electrol\u00edtico microfino<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">El mecanizado electrol\u00edtico es una t\u00e9cnica de fabricaci\u00f3n que utiliza el principio de disoluci\u00f3n electroqu\u00edmica del \u00e1nodo met\u00e1lico para eliminar material en forma de disoluci\u00f3n i\u00f3nica, lo que hace posible el mecanizado electrol\u00edtico para la microfabricaci\u00f3n. La necesidad de un gran espacio de procesamiento es uno de los principales factores que limitan la precisi\u00f3n del procesamiento electrol\u00edtico. Si el espacio de procesamiento pudiera reducirse significativamente, la precisi\u00f3n del procesamiento mejorar\u00eda notablemente y aumentar\u00eda la posibilidad de microfabricaci\u00f3n mediante electr\u00f3lisis. Reduciendo la tensi\u00f3n de mecanizado y la concentraci\u00f3n de electrolito, se ha logrado controlar la brecha de mecanizado a menos de 10\u03bcm. El uso de microalimentadores y electrodos de microtubos met\u00e1licos se ha utilizado para producir una capa de n\u00edquel de 0,2 mm.<\/span><span style=\"color: #051c2c; font-family: \u5fae\u8f6f\u96c5\u9ed1; font-style: inherit; font-weight: inherit;\">Se mecaniz\u00f3 un peque\u00f1o orificio de 0,17 mm en la placa.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">El mecanizado electrol\u00edtico tambi\u00e9n se utiliza en el acabado de piezas de ejes finos. De forma similar al rectificado EDM de microelectrodos de alambre, se utiliza un alambre met\u00e1lico m\u00f3vil como c\u00e1todo y se pulveriza un electrolito entre el eje del \u00e1nodo y el alambre del c\u00e1todo para producir microcorrosi\u00f3n electroqu\u00edmica en la superficie del eje. Este m\u00e9todo ha logrado buenos resultados en el pulido de peque\u00f1os ejes de decenas de micras de di\u00e1metro.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">La gama de tama\u00f1os que abarca la microfabricaci\u00f3n electrol\u00edtica es mucho mayor que los diminutos tama\u00f1os que se consiguen con la microfabricaci\u00f3n de silicio y la tecnolog\u00eda LIGA.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">(3) Tratamiento microfino por ultrasonidos<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">Con el uso generalizado de materiales duros y quebradizos como el silicio cristalino, el vidrio \u00f3ptico y la cer\u00e1mica de ingenier\u00eda en micromec\u00e1nica, la microfabricaci\u00f3n tridimensional de alta precisi\u00f3n de materiales duros y quebradizos se ha convertido en un importante tema de investigaci\u00f3n. Los principales m\u00e9todos disponibles actualmente para el procesamiento de materiales duros y quebradizos son la litograf\u00eda, la electroerosi\u00f3n, el procesamiento electrol\u00edtico, el procesamiento l\u00e1ser y el procesamiento ultras\u00f3nico. En comparaci\u00f3n con EDM, procesamiento electrol\u00edtico, procesamiento l\u00e1ser, procesamiento ultras\u00f3nico no depende de la conductividad el\u00e9ctrica del material y no hay efecto termof\u00edsico; en comparaci\u00f3n con la litograf\u00eda, y puede procesar una alta profundidad a la relaci\u00f3n de anchura de la estructura tridimensional, que determina el procesamiento ultras\u00f3nico en cer\u00e1mica, silicio semiconductor y otros materiales no met\u00e1licos duros y quebradizos procesamiento tiene la ventaja de<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">Impulso.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">La micros\u00f3nica tiene los mismos principios y caracter\u00edsticas que la ultras\u00f3nica convencional, salvo por el peque\u00f1o tama\u00f1o del proceso. Como la amplitud requerida para la ultras\u00f3nica convencional suele estar entre 0,01 y 0,1 mm, la deformaci\u00f3n de la piezoelectricidad o la magnetostricci\u00f3n es muy peque\u00f1a (de 0,005 a 0,01 mm), por lo que la amplitud debe ampliarse mediante una barra de amplitud superior gruesa y una inferior fina. En el caso de los ultrasonidos finos, las amplitudes piezoel\u00e9ctricas o magnetostrictivas ya son suficientes para la microfabricaci\u00f3n y, por tanto, no se necesita ninguna barra de amplitud.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">Utilizando la tecnolog\u00eda de microfabricaci\u00f3n por ultrasonidos, se han mecanizado microagujeros con un di\u00e1metro m\u00ednimo de 5 \u03bcm en materiales cer\u00e1micos de ingenier\u00eda mediante la vibraci\u00f3n de la pieza de trabajo.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">(4) Microfabricaci\u00f3n por l\u00e1ser<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">A diferencia de los procesos especiales tradicionales, el conformado por l\u00e1ser no consiste en eliminar material, sino en a\u00f1adirle material. Seg\u00fan el material procesado y el mecanismo, el conformado por l\u00e1ser puede dividirse en varios tipos, como el conformado por fotopolimerizaci\u00f3n, el conformado por sinterizado selectivo por l\u00e1ser y el conformado de s\u00f3lidos estratificados.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">El moldeo por fotopolimerizaci\u00f3n se basa en una resina fotosensible l\u00edquida. Una fuente de luz ultravioleta lejana se enfoca e irradia sobre la superficie de la resina l\u00edquida, y el \u00e1rea expuesta se polimeriza. Mediante el fotocurado pueden obtenerse microestructuras de entre 10 \u03bcm y 1 mm. Para resolver el problema de la producci\u00f3n por lotes, pueden utilizarse matrices de fibra \u00f3ptica de precisi\u00f3n para producir un gran n\u00famero de microestructuras a la vez:<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">(i) la precisi\u00f3n de la profundidad est\u00e1 limitada por el grosor de las capas colocadas; (ii) la influencia de los efectos dimensionales (viscosidad de la resina fotosensible l\u00edquida, tensi\u00f3n superficial); (iii) la influencia de la deformaci\u00f3n microestructural, etc.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">para<\/span><span style=\"color: #051c2c; font-family: \u5fae\u8f6f\u96c5\u9ed1; font-style: inherit; font-weight: inherit;\">Para eliminar estos efectos, ha surgido un nuevo m\u00e9todo de conformado por l\u00e1ser.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">Un haz l\u00e1ser focalizado se escanea en tres dimensiones en un ba\u00f1o de resina y la resina se cura s\u00f3lo cuando se supera el umbral de exposici\u00f3n en el punto focal, lo que permite crear microestructuras libremente m\u00f3viles. Las ventajas de esta t\u00e9cnica son:<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">(1) La profundidad y la precisi\u00f3n perif\u00e9rica vienen determinadas por el tama\u00f1o del punto de enfoque del l\u00e1ser, y la precisi\u00f3n es superior a 1 \u03bcm en tres dimensiones; (2) No se necesitan piezas de soporte ni m\u00e1scaras; (3) Se elimina la influencia de la viscosidad de la resina y la tensi\u00f3n superficial, ya que no hay piezas m\u00f3viles en el dep\u00f3sito de resina fotosensible l\u00edquida.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">(5) Electroconformado de precisi\u00f3n<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">El electroconformado de orificios se diferencia del m\u00e9todo de corte en que se crea el n\u00facleo del orificio, a continuaci\u00f3n el metal electroconformado crece a su alrededor y finalmente el n\u00facleo se retira o disuelve. En ocasiones en las que no se puede conseguir mediante el mecanizado por arranque de viruta convencional, como agujeros extremadamente finos y piezas con elevados requisitos de rugosidad superficial interna o piezas con formas de secci\u00f3n transversal especiales, se puede utilizar el electroconformado.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">Para los machos se utilizan sobre todo aleaciones de aluminio, que se disuelven en una soluci\u00f3n de hidr\u00f3xido de sodio, mientras que el n\u00edquel permanece intacto y puede trabajarse con confianza. Para la fabricaci\u00f3n de machos de aluminio especialmente finos, dif\u00edciles de cortar, puede utilizarse lat\u00f3n en su lugar, pero solo si se emplea un l\u00edquido adecuado que no corroa la superficie de n\u00edquel pero disuelva el lat\u00f3n r\u00e1pidamente.<\/span><\/p><p style=\"font-size: 16px; font-style: normal; font-weight: 400;\"><span style=\"font-family: \u5fae\u8f6f\u96c5\u9ed1; color: #051c2c;\">Cualquiera que sea la forma del orificio, su precisi\u00f3n dimensional y su rugosidad superficial vienen determinadas por la calidad del n\u00facleo, por lo que no importa lo fino que sea el orificio, siempre que se pueda utilizar un determinado m\u00e9todo de procesamiento para crear el n\u00facleo, se puede utilizar el m\u00e9todo de electroconformado para procesar el orificio.<\/span><\/p>\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-16b3f2b3 elementor-widget elementor-widget-text-editor\" data-id=\"16b3f2b3\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<p>Ofrecemos<span style=\"color: #0e2143;\"><b><a style=\"color: #0e2143;\" href=\"https:\/\/www.accscicn.com\/es\/nanofabricacion\/\" target=\"_blank\" rel=\"noopener\">Servicios de dise\u00f1o de dispositivos MEMS \/ procesamiento de microestructuras y nanoestructuras<\/a>,<\/b><\/span> No dude en dejarnos un mensaje con su consulta.<\/p>\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-19d957c8 elementor-widget elementor-widget-wpforms\" data-id=\"19d957c8\" data-element_type=\"widget\" data-widget_type=\"wpforms.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t<div class=\"wpforms-container wpforms-container-full\" id=\"wpforms-26998\"><form id=\"wpforms-form-26998\" class=\"wpforms-validate wpforms-form wpforms-ajax-form\" data-formid=\"26998\" method=\"post\" 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srcset=\"https:\/\/www.accscicn.com\/wp-content\/uploads\/2024\/05\/\u5fae\u900f\u955c\u9635\u5217-300x259.png 300w, https:\/\/www.accscicn.com\/wp-content\/uploads\/2024\/05\/\u5fae\u900f\u955c\u9635\u5217-14x12.png 14w, https:\/\/www.accscicn.com\/wp-content\/uploads\/2024\/05\/\u5fae\u900f\u955c\u9635\u5217.png 434w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/div>\n\t\t<\/a>\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/www.accscicn.com\/es\/producto\/2pp-polimerizacion-de-dos-fotones\/\" >\n\t\t\t\tSistema de impresi\u00f3n 3D por polimerizaci\u00f3n bifot\u00f3nica de alta precisi\u00f3n\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/www.accscicn.com\/es\/producto\/2pp-polimerizacion-de-dos-fotones\/\" aria-label=\"M\u00e1s informaci\u00f3n sobre Sistema de impresi\u00f3n 3D por polimerizaci\u00f3n bifot\u00f3nica de alta precisi\u00f3n\" tabindex=\"-1\" >\n\t\t\tLeer M\u00e1s \"\t\t<\/a>\n\n\t\t\t\t<\/div>\n\t\t\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-28732 page type-page status-publish has-post-thumbnail hentry category-nanofabrication\">\n\t\t\t\t<a class=\"elementor-post__thumbnail__link\" href=\"https:\/\/www.accscicn.com\/es\/nanofabricacion\/conjuntos-de-microlentes\/\" tabindex=\"-1\" >\n\t\t\t<div class=\"elementor-post__thumbnail\"><img decoding=\"async\" width=\"300\" height=\"203\" src=\"https:\/\/www.accscicn.com\/wp-content\/uploads\/2022\/10\/\u5fae\u900f\u955c\u9635\u5217-300x203.jpg\" class=\"attachment-medium size-medium wp-image-28741\" alt=\"\" srcset=\"https:\/\/www.accscicn.com\/wp-content\/uploads\/2022\/10\/\u5fae\u900f\u955c\u9635\u5217-300x203.jpg 300w, https:\/\/www.accscicn.com\/wp-content\/uploads\/2022\/10\/\u5fae\u900f\u955c\u9635\u5217-768x520.jpg 768w, https:\/\/www.accscicn.com\/wp-content\/uploads\/2022\/10\/\u5fae\u900f\u955c\u9635\u5217.jpg 1018w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/div>\n\t\t<\/a>\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/www.accscicn.com\/es\/nanofabricacion\/conjuntos-de-microlentes\/\" >\n\t\t\t\tMatrices de microlentes para micro\u00f3ptica y nano\u00f3ptica\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/www.accscicn.com\/es\/nanofabricacion\/conjuntos-de-microlentes\/\" aria-label=\"M\u00e1s informaci\u00f3n sobre Micro-Nano Optics\u4e28Microlens arrays (OEM)\" tabindex=\"-1\" >\n\t\t\tLeer M\u00e1s \"\t\t<\/a>\n\n\t\t\t\t<\/div>\n\t\t\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-28462 page type-page status-publish has-post-thumbnail hentry category-nanofabrication tag-nanoimprint-lithography\">\n\t\t\t\t<a class=\"elementor-post__thumbnail__link\" href=\"https:\/\/www.accscicn.com\/es\/nanofabricacion\/litografia-de-nanoimpresion\/\" tabindex=\"-1\" >\n\t\t\t<div class=\"elementor-post__thumbnail\"><img loading=\"lazy\" decoding=\"async\" width=\"300\" height=\"225\" src=\"https:\/\/www.accscicn.com\/wp-content\/uploads\/2022\/10\/2D-hexagonal-grid-300x225.jpg\" class=\"attachment-medium size-medium wp-image-28516\" alt=\"\" srcset=\"https:\/\/www.accscicn.com\/wp-content\/uploads\/2022\/10\/2D-hexagonal-grid-300x225.jpg 300w, https:\/\/www.accscicn.com\/wp-content\/uploads\/2022\/10\/2D-hexagonal-grid-768x576.jpg 768w, https:\/\/www.accscicn.com\/wp-content\/uploads\/2022\/10\/2D-hexagonal-grid.jpg 1024w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/div>\n\t\t<\/a>\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/www.accscicn.com\/es\/nanofabricacion\/litografia-de-nanoimpresion\/\" >\n\t\t\t\tNanoimpresi\u00f3n (NIL) Subcontrataci\u00f3n\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\n\t\t<a class=\"elementor-post__read-more\" 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