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Etching Process - Etching
With 10 years of micro/nano experience, our advanced micro/nano processing solutions ensure that you save time, effort and energy throughout the entire micro/nano manufacturing process, reducing significant cost waste as well as optimizing the efficiency and effectiveness of the entire production.
What is etching?
Etching in micro and nano processing technology is the process of removing unnecessary materials attached to the wafer surface using chemical or physical methods. The main steps of semiconductor manufacturing include photolithography, etching, and thin film deposition, which are continuously cycled to create complex and fine circuit structures.
Our Capabilities
Etching process
Reactive ion etching
(RIE-Reactive Ion Etching)
The most widely used and most capable technology for micro and nano processing, etching Si, SiO₂, SiNx, etc.
Etching process
Deep Reactive Ion Etching
(DRIE-Deep Reactive Ion Etching)
Etching uniformity UN<3%; deep Si etching rate 2-10um/min; Sio2 and SiNx etching rate 20-150nm/min
Etching process
Focused Ion Beam Etching
(FIBE-Focused Ion Beam Etching)
Micro and nano processing of materials and devices such as etching, deposition and doping
Etching process
Ion beam sputter etching
(IBE-Ion Beam Etching)
For metals or other substances that are difficult to etch
Etching process
Inductive/capacitive coupled plasma etching
(ICP/CCP-Inductively/capacitance Coupled Plasma)
Etching GaN, GaAs, InP and other materials
Etching process
Wet etching (wet etching)
Can handle 2inc-8inc inorganic and inorganic cleaning, as well as conventional acid and alkali corrosion
Etching materials
Etching materials
Common etching materials
Silicon, silicon oxide, silicon nitride, metal, quartz, sapphire and other materials
Etching materials
Wet etching solution
Acetic acid (H3COOH).
Hydrochloric acid (HCl)
Hydrofluoric acid (HF)
Nitric acid (HNO3)
Phosphoric acid (H3PO4)
potassium hydroxide (KOH), sodium hydroxide (NaOH)
Sodium hydroxide (NaOH)
Sulfuric acid (H2SO4)
Aqua regia (3 HCl : 1 HNO3)
Production Process
1. Preliminary offer
Send your drawings and requirements to our development manager for an initial quote
2. Program determination
We will optimize and determine the plan and quotation based on the drawings and requirements
3.Production and quality control
We will select the best equipment for your product and take full responsibility for your product to meet our standards.
4. Delivery on time
Delivered to you on time
Quality Inspection
Detection means
Optical microscopy (Microscopy)
Detection means
Profilometer (Profilometer)
Detection means
Sheet Resistance Measurement
Detection means
Hall measurement )
Cases we have done
Micro and nano structures
Diffractive Optical Elements (DOE)
Micro and nano structures
Superlenses (METALENSES)
Micro and nano structures
Diffraction grating (line point, shine, tilt)
Micro-Nano Architecture
Microlens arrays
Applications
Micro and Nano Applications
Microlens arrays
Micro and Nano Applications
Line grid polarizer
Micro and Nano Applications
Sensors
Micro and Nano Applications
Flexible Electronics
Micro and Nano Applications
Anti-reflective film
Micro and Nano Applications
OLED Panel
Micro and Nano Applications
Microfluidic channels/chips
Micro and Nano Applications
AR Optical Waveguide
Our Advantages
Advantages
Full process coverage
Cooperate with many domestic experiments and have different processing technology reserve from 100um-5nm
Advantages
High standard quality control
We adhere to the spirit of 6sigma service, choose the most suitable experimental platform, process, personnel, materials for processing
Advantages
Quick Response
From idea to implementation, our experts will provide professional advice and ongoingTrackingServices
Advantages
Save time and worry
Turnkey service, from principle implementation, drawing design, raw material procurement, to finished product processing
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