Etching Process - Etching

With 10 years of micro/nano experience, our advanced micro/nano processing solutions ensure that you save time, effort and energy throughout the entire micro/nano manufacturing process, reducing significant cost waste as well as optimizing the efficiency and effectiveness of the entire production.

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What is etching?

Etching in micro and nano processing technology is the process of removing unnecessary materials attached to the wafer surface using chemical or physical methods. The main steps of semiconductor manufacturing include photolithography, etching, and thin film deposition, which are continuously cycled to create complex and fine circuit structures.

Our Capabilities


Etching process

Reactive ion etching
(RIE-Reactive Ion Etching)

The most widely used and most capable technology for micro and nano processing, etching Si, SiO₂, SiNx, etc.

Etching process

Deep Reactive Ion Etching
(DRIE-Deep Reactive Ion Etching)

Etching uniformity UN<3%; deep Si etching rate 2-10um/min; Sio2 and SiNx etching rate 20-150nm/min

Etching process

Focused Ion Beam Etching
(FIBE-Focused Ion Beam Etching)

Micro and nano processing of materials and devices such as etching, deposition and doping

Etching process

Ion beam sputter etching
(IBE-Ion Beam Etching)

For metals or other substances that are difficult to etch

Etching process

Inductive/capacitive coupled plasma etching
(ICP/CCP-Inductively/capacitance Coupled Plasma)

Etching GaN, GaAs, InP and other materials

Etching process

Wet etching (wet etching)

Can handle 2inc-8inc inorganic and inorganic cleaning, as well as conventional acid and alkali corrosion

Etching materials

Etching materials

Common etching materials

Silicon, silicon oxide, silicon nitride, metal, quartz, sapphire and other materials

Etching materials

Wet etching solution

Acetic acid (H3COOH). Hydrochloric acid (HCl) Hydrofluoric acid (HF) Nitric acid (HNO3) Phosphoric acid (H3PO4) potassium hydroxide (KOH), sodium hydroxide (NaOH) Sodium hydroxide (NaOH) Sulfuric acid (H2SO4) Aqua regia (3 HCl : 1 HNO3)

Production Process

1. Preliminary offer

Send your drawings and requirements to our development manager for an initial quote

2. Program determination

We will optimize and determine the plan and quotation based on the drawings and requirements

3.Production and quality control

We will select the best equipment for your product and take full responsibility for your product to meet our standards.

4. Delivery on time

Delivered to you on time

Quality Inspection

Detection means

Optical microscopy (Microscopy)

Detection means

Profilometer (Profilometer)

Detection means

Sheet Resistance Measurement

Detection means

Hall measurement )

Cases we have done

Micro and nano structures

Diffractive Optical Elements (DOE)

Micro and nano structures

Superlenses (METALENSES)

Micro-Nano Architecture

Microlens arrays


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Micro and Nano Applications

Microlens arrays

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Micro and Nano Applications

Line grid polarizer

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Micro and Nano Applications


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Micro and Nano Applications

Flexible Electronics

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Micro and Nano Applications

Anti-reflective film

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Micro and Nano Applications

OLED Panel

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Micro and Nano Applications

Microfluidic channels/chips

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Micro and Nano Applications

AR Optical Waveguide

Our Advantages


Full process coverage

Cooperate with many domestic experiments and have different processing technology reserve from 100um-5nm


High standard quality control

We adhere to the spirit of 6sigma service, choose the most suitable experimental platform, process, personnel, materials for processing


Quick Response

From idea to implementation, our experts will provide professional advice and ongoingTrackingServices


Save time and worry

Turnkey service, from principle implementation, drawing design, raw material procurement, to finished product processing

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